Printed circuit board with embedded heater
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 21, 2015
Grant Date -
Jul 18, 2013
app pub date -
May 29, 2012
filing date -
Jan 13, 2012
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Aspects of the present invention are directed to providing a printed circuit board including a top conductive layer; a bottom conductive layer; a plurality of electronic components arranged on at least one of the top conductive layer or the bottom conductive layer; a heater layer interposed between the top conductive layer and the bottom conductive layer and configured to generate and transfer heat to at least one of the electronic components.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully