Integrated circuit package including embedded thin-film battery

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United States of America Patent

PATENT NO 9012264
APP PUB NO 20140315334A1
SERIAL NO

14321422

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Abstract

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An integrated circuit package is provided with a thin-film battery electrically connected to and encapsulated with an integrated circuit die. The battery can be fabricated on a dedicated substrate, on the die pad, or on the integrated circuit die itself.

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Patent Owner(s)

Patent OwnerAddress
STMICROELECTRONICS INCCOPPELL TX

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Du, Haibin The Colony, US 4 49
Hundt, Michael J Double Oak, US 48 1257
Kelappan, Krishnan Carrollton, US 14 315
Sigmund, Frank Coppell, US 4 86

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