Epoxy resin adhesive composition and perforated floor panel for clean room comprising the same
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United States of America Patent
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Apr 21, 2015
Grant Date -
Nov 14, 2013
app pub date -
Nov 29, 2012
filing date -
May 10, 2012
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Abstract
The present invention provides an epoxy resin adhesive composition and a perforated floor panel for a clean room including the same. The epoxy resin adhesive composition is a two-component epoxy resin adhesive composition comprising a main material including graphite having conductivity and a curing agent including a amide compound, wherein the main material and the curing agent are mixed at a weight ratio of 2:1. When this epoxy resin adhesive composition is disposed between a base panel and a resin tile constituting the perforated floor panel for a clean room, the adhesion between the base panel and the resin tile becomes high, heat is easily discharged to the outside by graphite, and the generation of static electricity can be reduced.
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