Injection molding device and method for discharging heat medium for injection molding device
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United States of America Patent
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Apr 21, 2015
Grant Date -
Sep 27, 2012
app pub date -
Apr 21, 2010
filing date -
Apr 21, 2010
priority date (Note) -
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Abstract
The injection molding device of the present invention is provided with a supply pipe which supplies a heat medium to a mold, a discharge pipe which discharges the heat medium from the mold, a mold temperature adjustor to which the supply pipe and the discharge pipe are connected to adjust the temperature of the mold, and a discharge rate adjusting unit which is provided with a variable flow control valve installed on the discharge pipe to adjust a flow rate of the heat medium, a discharge pipe variable flow control valve bypass pipe for bypassing the variable flow control valve and a discharge pipe bypass on-off valve installed on the bypass pipe to change a flow rate of the heat medium and which is installed at a position upstream from the mold temperature adjustor on the discharge pipe.
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