Device and method for holding a substrate
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United States of America Patent
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Apr 21, 2015
Grant Date -
May 24, 2007
app pub date -
Nov 22, 2006
filing date -
Nov 23, 2005
priority date (Note) -
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status (Latency Note)
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Abstract
A device and method for holding a substrate, e.g., a semiconductor wafer, during a process, e.g., a liquid meniscus process, the substrate having a first side and a second side. The device includes one or more holding components, e.g., fingers, configured to contact a second side of the substrate without significantly contacting the first side of the substrate. At least one of the holding components may be configured to be moved during the process so as to prevent the at least one holding components from effecting the process, e.g., contacting the liquid meniscus. Such an arrangement may be employed when the substrate includes a top side having at least one structure or feature thereon, it being desirable that the holding components avoid contact with the structures or features during the process.
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