Multimedia platform
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United States of America Patent
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Apr 14, 2015
Grant Date -
Nov 3, 2011
app pub date -
Jul 15, 2011
filing date -
Sep 15, 2005
priority date (Note) -
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Abstract
A multimedia platform is discussed, which includes a first stacking unit including a first substrate and a multimedia processor, wherein the first substrate and the multimedia processor are stacked on the first stacking unit, a pattern and a via hole are formed on the first substrate, and the multimedia processor is mounted on top of the first substrate; a second stacking unit including a second substrate and a plurality of storage devices, wherein the second substrate and the plurality of storage devices are stacked on the second stacking unit, a pattern and a via hole being formed on the second substrate, and the plurality of storage devices are mounted on top of the second substrate; and at least one solder ball arranged on the first stacking unit, the at least one solder ball allowing the first substrate to be coupled to the second substrate.
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