Method and apparatus for transfer lamination
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United States of America Patent
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Apr 14, 2015
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app pub date -
Jun 10, 2010
filing date -
Jun 12, 2009
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Abstract
An embodiment of the inventive method of transfer lamination bonding a first metallized side of a film to a substrate. Then a breakaway coating is applied to a second, non-metallized side of the film after the first metallized side has been bonded to the substrate. The bonded film and substrate are then placed in an oven. The film is then stripped from the substrate leaving metal from the film deposited on the substrate. The application of the breakaway coating is performed as an inline part of the transfer lamination process thereby providing an ease of manufacture presently unknown.
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