Electronic package structure
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United States of America Patent
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Apr 7, 2015
Grant Date -
Sep 20, 2012
app pub date -
Jun 1, 2012
filing date -
Feb 18, 2008
priority date (Note) -
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Abstract
The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the second external electrode electrically connected to the second conductive element are both disposed on the top surface of the body or a first surface formed by the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound.
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