Fine pitch probes for semiconductor testing, and a method to fabricate and assemble same
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United States of America Patent
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Apr 7, 2015
Grant Date -
May 15, 2014
app pub date -
Jan 17, 2013
filing date -
Nov 15, 2012
priority date (Note) -
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Abstract
An apparatus for testing electronic devices is disclosed. The apparatus includes a plurality of probes attached to a substrate; each probe capable of elastic deformation when the probe tip comes in contact with the electronic; each probe comprising a plurality of isolated electrical vertical interconnected accesses (vias) connecting each probe tip to the substrate, such that each probe tip of the plurality is capable of conducting an electrical current from the device under test to the substrate. The plurality of probes may form a probe comb. Also disclosed is a probe comb holder that has at least one slot where the probe comb may be disposed. A method for assembling and disassembling the probe comb and probe comb holder is also disclosed which allows for geometric alignment of individual probes.
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