Semiconductor structure

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United States of America Patent

PATENT NO 9000569
APP PUB NO 20150069584A1
SERIAL NO

14042976

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Abstract

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A semiconductor structure includes a carrier, a first protective layer, a second protective layer, and a third protective layer. A first surface of the first protective layer comprises a first anti-stress zone. A first extension line from a first bottom edge intersects with a second extension line from a second bottom edge to form a first base point. A first projection line is formed on the first surface, an extension line of the first projection line intersects with the second bottom edge to form a first intersection point, a second projection line is formed on the first surface, and an extension line of the second projection line intersects with the first bottom edge to form a second intersection point. A zone by connecting the first base point, the first intersection point and the second intersection point is the first anti-stress zone.

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Patent Owner(s)

Patent OwnerAddress
CHIPBOND TECHNOLOGY CORPORATIONNO 3 LIHSIN 5 RD HSINCHU SCIENCE PARK HSINCHU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hsieh, Chin-Tang Kaohsiung, TW 33 109
Hsu, You-Ming Kaohsiung, TW 12 23
Liu, Ming-Sheng Hsinchu, TW 4 4
Wang, Chih-Ping Hsinchu County, TW 18 526

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