Method for creating semiconductor junctions with reduced contact resistance
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United States of America Patent
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Apr 7, 2015
Grant Date -
Feb 26, 2015
app pub date -
Nov 3, 2014
filing date -
Oct 25, 2011
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Abstract
Embodiments of the invention relate generally to creating semiconductor junctions with reduced contact resistance. In one embodiment, the invention provides a method of forming a composition of material, the method comprising: providing at least two populations of semiconducting materials; layering the at least two populations of semiconducting materials to form at least two layers; and consolidating the at least two populations of semiconducting materials, wherein the consolidating creates an electrical connection between the at least two layers.
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