Solder joint
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Apr 7, 2015
Grant Date -
Oct 21, 2010
app pub date -
Oct 20, 2008
filing date -
Oct 19, 2007
priority date (Note) -
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Abstract
A solder joint manufactured of an alloy essentially composed of 0.01-7.6 wt % Cu, 0.001-6 wt % Ni, and the remaining of Sn. Each of Cu and Ni has a maximum concentration range. The lower limit of the range of Ni is 0.01 wt % and preferably 0.03 wt %. The upper limit of the range of Ni is 0.3 wt % and preferably 0.1 wt %. The lower limit of the range of Cu is 0.1 wt % and preferably 0.2 wt %. The upper limit of the range of Cu is 7 wt % and preferably 0.92 wt %. The invention includes the solder joint essentially having these compositions.
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