Die bonder and bonding method

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United States of America Patent

PATENT NO 8991681
APP PUB NO 20130068823A1
SERIAL NO

13412684

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Abstract

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A die bonder and a bonding method are disclosed which make it possible to provide high-quality products, particularly even if a die is rotated through predetermined degrees relative to an already-bonded die and then laminated.

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Patent Owner(s)

Patent OwnerAddress
FASFORD TECHNOLOGY CO LTDYAMANASHI PREFECTURE YAMANASHI

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Maki, Hiroshi Kumagaya, JP 56 509
Mochizuki, Masayuki Kumagaya, JP 40 148
Mochizuki, Takehito Kumagaya, JP 3 15
Tani, Yukio Kumagaya, JP 38 121

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