Heat sink package and method of manufacturing
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United States of America Patent
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Mar 24, 2015
Grant Date -
May 24, 2012
app pub date -
Mar 24, 2010
filing date -
Mar 27, 2009
priority date (Note) -
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Abstract
A circuit element is arranged on an organic substrate and connected to a wiring pattern arranged on the organic substrate. An internal connection electrode is formed on a conductive support body by electroforming so as to obtain a unitary block of the internal connection electrode and the support body. Each end of each of the internal connection electrodes connected into a unitary block by the support body is connected to the wiring pattern. After the circuit element is sealed by resin, the support body is peeled off, so as to obtain individual internal connection electrodes separately and the other end of each of the internal connection electrodes is used as an external connection electrode on the front surface while the external connection electrode on the rear surface is connected to the wiring pattern.
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