Flexible chip set encapsulation structure
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United States of America Patent
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Mar 24, 2015
Grant Date -
Mar 12, 2015
app pub date -
Sep 10, 2013
filing date -
Sep 10, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
A flexible chip set encapsulation structure includes a chip set. The chip set comprises a plurality of spaced chips and a fixing film. The fixing film is adapted to wrap and fix the chips. The fixing film has at least one bending portion at a predetermined position for the fixing film to have flexibility in a predetermined direction. Thus, the flexible chip set encapsulation structure is flexible for bending. When the user wears the flexible chip set, the movement of the user won't be confined. Besides, the chip set is completely attached to the body to provide a comfortable wear, and the chips provide a better far infrared radiation effect.
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