Polyimide resin composition for semiconductor devices, method of forming film in semiconductor devices using the same and semiconductor devices
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United States of America Patent
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Mar 24, 2015
Grant Date -
Sep 1, 2011
app pub date -
Feb 25, 2011
filing date -
Feb 26, 2010
priority date (Note) -
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Abstract
Disclosed is a polyimide composition for semiconductor devices, which has a rheological characteristics suited for screen printing and dispense coating, which has an improved wetting property with various coating bases, by which continuous printing of 500 times or more can be attained, with which blisters, cissing and pinholes are not generated after printing and drying or during drying or curing, which can coat a desired area. A method of forming a film in a semiconductor and semiconductors having the film formed by this method as an insulation film, protective film or the like are also disclosed. The composition for semiconductor devices contains a mixed solvent of a first organic solvent (A) and a second organic solvent (B); and a polyimide resin having at least one group selected from the group consisting of alkyl groups and perfluoroalkyl groups in recurring units, and having thixotropic property, the polyimide resin being dissolved in the mixed solvent.
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