Heating apparatus for heating electronic components on a printed circuit board in low temperature environment
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United States of America Patent
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Mar 17, 2015
Grant Date -
Jan 30, 2014
app pub date -
Jul 24, 2012
filing date -
Jul 24, 2012
priority date (Note) -
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Abstract
A heating apparatus for heating electronic components on a printed circuit board in low temperature environment includes a printed circuit board, a heating unit, a switch unit, a temperature-sensing unit, an electric power unit, and a control unit. The heating unit, the switch unit, the temperature-sensing unit, and the control unit are fixed connected to the printed circuit board and are electrically connected with the metal lines on the printed circuit board. The heat source is sent to the heat-conducting layer on the printed circuit board through the heat-conducting terminal after the switch unit is conducted by the control unit and the power is sent from the electric power unit to the heating unit. Then, the electronic components are heated with the heat source through the heat-conducting layer, so that the electronic components are in the working temperatures for starting up.
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