Wiring board and method of manufacturing the same

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United States of America Patent

PATENT NO 8981234
APP PUB NO 20110114375A1
SERIAL NO

13003103

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Abstract

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Adhesiveness between a wiring layer and a resin layer is improved by forming a nitrided resin layer by nitriding a surface of a substrate by plasma, and furthermore, thinly forming a copper nitride film prior to forming a copper film.

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Patent Owner(s)

Patent OwnerAddress
NATIONAL UNIVERSITY CORPORATION TOHOKU UNIVERSITY1-1 KATAHIRA 2-CHOME AOBA-KU SENDAI-SHI MIYAGI 980-8577
DAISHO DENSHI CO LTDTOKYO 145-0071

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Goto, Tetsuya Sendai, JP 123 2118
Ohmi, Tadahiro Sendai, JP 798 14083

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