Heat conducting structure with coplanar heated portion, manufacturing method thereof, and heat sink therewith
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United States of America Patent
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Mar 17, 2015
Grant Date -
Apr 25, 2013
app pub date -
Dec 16, 2012
filing date -
Sep 18, 2009
priority date (Note) -
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Abstract
A heat conducting structure, a heat sink with the heat conducting structure, and a manufacturing method of the heat conducting structure are disclosed. The manufacturing method includes the steps of providing a first mold (20) and a second mold (30) having different concave cambers (211, 211a, 221, 221a), using the first mold (20) to progressively compress the heat pipes (10) and form a camber (112) at an evaporating section (11), using the second mold (30) to compress the camber (112) to form a contact plane (112′) and an attaching plane (113′) perpendicular to each other, coating an adhesive (50) on the contact planes (112′), connecting the contact planes to make the attaching planes co-planar.
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