Method for cutting panel substrate and substrate cutting apparatus
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United States of America Patent
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Mar 17, 2015
Grant Date -
Feb 7, 2013
app pub date -
Sep 26, 2011
filing date -
Aug 5, 2011
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Abstract
The present invention provides a method for cutting a panel substrate and a substrate cutting apparatus. The substrate cutting apparatus comprises a first cutting unit and a second cutting unit. The method comprises the following steps: cutting off a first residual material and a second residual material at two opposite sides of the panel substrate; cutting off a third residual material and a fourth residual material at another two opposite sides of the panel substrate; cutting the panel substrate into a plurality of elongated substrates; and cutting each of the elongated substrates into the panel units. The present invention can reduce a process time for cutting the panel substrate.
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