Multiple chip package module having inverted package stacked over die
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United States of America Patent
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Mar 3, 2015
Grant Date -
Jun 23, 2005
app pub date -
Dec 16, 2004
filing date -
Dec 17, 2003
priority date (Note) -
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Abstract
A module having multiple die includes a first die on a first substrate and an inverted second package stacked over the first die, with, where necessary, provision is made for a standoff between the second package and the first die. Also, methods for making the module include steps of providing a first package having a first die attached onto an upward facing side of a first package substrate, and stacking an inverted second package over the die on the first package, provision being made where necessary for a standoff between the second package and the first package die to avoid damaging impact between the downward-facing side of the second package and wire bonds connecting the first die to the first package substrate.
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