Epoxy resin composition, resin sheet, prepreg, multilayer printed wiring board and semiconductor device
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United States of America Patent
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Mar 3, 2015
Grant Date -
Jan 13, 2011
app pub date -
Mar 24, 2009
filing date -
Mar 25, 2008
priority date (Note) -
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status (Latency Note)
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Abstract
An object of the present invention is to provide an epoxy resin composition that provides, when used for an insulation layer of a multilayer printed wiring board, a multilayer printed wiring board which is excellent in plating adhesion, heat resistance and moisture resistance reliability and capable of forming fine wiring. Another object of the present invention is to provide a resin sheet, a prepreg, a method for producing a multilayer printed wiring board, a multilayer printed wiring board and a semiconductor device.
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International Classification(s)
- C08J:WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTE....
- C08G:MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN B....
- B29C:SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTAN....
- C08F:MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONL....
- C08L:COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....
- H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....
- C08K:USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUB....
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