Sputtering device and sputtering method

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United States of America Patent

PATENT NO 8968538
APP PUB NO 20110223346A1
SERIAL NO

13121338

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Abstract

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A magnetic film having excellent uniformity in in-plane distribution of film thickness or sheet resistance is formed when the film is formed by forming a magnetic field on a processing surface of a substrate (21) and performing oblique incidence sputtering by using high discharge power.

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Patent Owner(s)

Patent OwnerAddress
CANON ANELVA CORPORATIONKANAGAWA KAWASAKI-SHI

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kitada, Toru Cupertino, US 19 38
Konno, Takeo Kawasaki, JP 7 70
Nagai, Motonobu Tokyo, JP 14 176
Suenaga, Masahiro Tokyo, JP 9 176
Watanabe, Naoki Kawasaki, JP 375 4361

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