Compact device package
Number of patents in Portfolio can not be more than 2000
United States of America
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Feb 24, 2015
Issued Date -
N/A
app pub date -
Jan 11, 2013
filing date -
Jan 11, 2013
priority date (Note) -
Withdrawn
status (Latency Note)
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Abstract
Various embodiments related to a compact device package are disclosed herein. In some arrangements, a flexible substrate can be coupled to a carrier having walls angled relative to one another. The substrate can be shaped to include two bends. First and second integrated device dies can be mounted on opposite sides of the substrate between the two bends in various arrangements.
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