Semiconductor chip with seal ring and sacrificial corner pattern

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United States of America Patent

PATENT NO 8963291
APP PUB NO 20110215447A1
SERIAL NO

13112738

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Abstract

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A semiconductor device including a low dielectric constant film of which the relative dielectric constant is less than 3.5, is provided with one or more seal rings that are moisture blocking walls forming a closed loop in a plan view, and where at least one of the seal rings includes a seal ring protrusion portion in inward protruding form in the vicinity of a chip corner.

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Patent Owner(s)

Patent OwnerAddress
ACACIA RESEARCH GROUP LLC767 3RD AVE 6TH FLOOR NEW YORK NY 10017

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Furusawa, Takeshi Chiyoda-ku, JP 60 732
Goto, Kinya Chiyoda-ku, JP 20 152
Matsuura, Masazumi Chiyoda-ku, JP 45 973
Miura, Noriko Chiyoda-ku, JP 26 176

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