Interconnect for high-frequency printed circuit
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United States of America Patent
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Feb 17, 2015
Grant Date -
Sep 8, 2011
app pub date -
Sep 10, 2010
filing date -
Sep 11, 2009
priority date (Note) -
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Abstract
The invention relates to a printed circuit for high-frequency signals, and more particularly to interconnect means between transmission lines situated on different faces of the printed circuit. According to the invention, in the vicinity of the interconnect means, the transmission lines each extend in a main direction. The interconnect means comprise two vias each extending along an axis. In a plane containing the main direction of a first of the transmission lines and perpendicular to the face bearing the first transmission line, an orthogonal fix is formed whose abscissa is borne by the main direction of the first transmission line. The abscissae of the axes of the vias or of their projection on the plane, perpendicularly to the plane, are separate.
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