Method for enhancing the yield rate of ball implanting of a substrate of an integrated circuit
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United States of America Patent
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Feb 17, 2015
Grant Date -
Nov 20, 2014
app pub date -
May 17, 2013
filing date -
May 17, 2013
priority date (Note) -
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Abstract
A method is used for implanting solder balls of an integrated circuit by operating a ball implanting machine. The ball implanting machine includes a suction fixture, an evacuating device, two pivoting and inverting devices, a guide plate, a ball carrier, and a substrate. The suction fixture has a plurality of ball grooves. The guide plate has a plurality of guide holes each aligning with a respective one of the ball grooves of the suction fixture. The ball carrier contains a plurality of solder balls. Thus, each of the solder balls is extended through the respective guide hole of the guide plate into the respective ball groove of the suction fixture, so that the solder balls will not protrude outward from the guide plate and will not interfere with or jam each other during movement of the ball carrier.
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