X-ray stress measurement method and apparatus

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United States of America Patent

PATENT NO 8953743
APP PUB NO 20140029726A1
SERIAL NO

13917829

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Abstract

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A sample (1) is irradiated with X-rays at different incident angles from plural X-ray sources (21, 22). Attention is focused on a Debye-ring of each X-ray diffraction emitted conically from the sample in association with incident X-ray from each of the X-ray sources (21, 22), and stress in the sample (1) is determined on the basis of information of X-ray diffraction appearing at an intersection point between the Debye-ring of the X-ray diffraction recorded on an image plate (30) and an equatorial plane (H) and information of X-ray diffraction appearing in the neighborhood of the intersection point between the Debye-ring and the equatorial plane (H).

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Patent Owner(s)

Patent OwnerAddress
RIGAKU CORPORATIONAKISHIMA-SHI TOKYO 196-8666

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Yasukawa, Shoichi Tokyo, JP 6 24

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