Semiconductor package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Feb 10, 2015
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N/A
app pub date -
Apr 27, 2012
filing date -
Sep 30, 2011
priority date (Note) -
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Abstract
A semiconductor package including a first package having a first semiconductor chip, a plurality of first inner leads electrically connected to the first semiconductor chip, and a plurality of first outer leads extending from the first inner leads and electrically connected to an external apparatus; and a second package having a second semiconductor chip and a plurality of second inner leads electrically connected to the second semiconductor chip, wherein an inactive surface of the first semiconductor chip and an inactive surface of the second semiconductor chip face each other, and the first inner leads contact the second inner leads to be electrically connected to each other.
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