Method for fabricating sensor
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United States of America Patent
Stats
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Jun 2, 2015
Grant Date -
Nov 13, 2014
app pub date -
Nov 16, 2012
filing date -
Nov 16, 2012
priority date (Note) -
Withdrawn
status (Latency Note)
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Abstract
A method for fabricating a sensor includes: forming, on a base substrate, a pattern of a source electrode and a drain electrode, a pattern of a data line, a pattern of a receiving electrode, a pattern of a photodiode, and a pattern of a transparent electrode disposed by using a first patterning process; forming a pattern of an ohmic layer by using a second patterning process; forming a pattern of an active layer by using a third patterning process; forming a pattern of a gate insulating layer by using a fourth patterning process, wherein the gate insulating layer has a via hole above the transparent electrode; and forming a pattern of a gate electrode, a pattern of a gate line, and a pattern of a bias line connected to the transparent electrode via the via hole above the transparent electrode by using a fifth patterning process.
First Claim
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International Classification(s)
- 2012 Application Filing Year
- H01L Class
- 20465 Applications Filed
- 18077 Patents Issued To-Date
- 88.34 % Issued To-Date
Cited Art Landscape
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- 0 Citation Count
- H01L Class
- 0 % this patent is cited more than
- 10 Age
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