MEMS mass flow sensor assembly and method of making the same
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United States of America Patent
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Feb 10, 2015
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app pub date -
Jan 8, 2013
filing date -
Jan 8, 2013
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Abstract
A silicon mass flow sensor manufacture process that enables the backside contacts and eliminates the conventional front side wire binding process, and the assembly of such a mass flow sensor is disclosed in the present invention. The achieved assembly enhances the reliability by eliminating the binding wire exposure to the flow medium that may lead to detrimental failure due to the wire shortage or breakage while the miniature footprint could be maintained. The assembly further reduces flow instability from the flow sensor package including the bump of wire sealing. The invented mass flow sensor assembly can be a flow sensor module if the supporting sensor carrier is pre-designed with the control electronics. Without the control electronics, the said mass flow sensor assembly is easy to install into desired flow channels and connect to the external control electronics.
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