Short and low loop wire bonding
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 3, 2015
Issued Date -
N/A
app pub date -
Aug 12, 2013
filing date -
Apr 11, 2011
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A multi-die package includes a first semiconductor die and a second semiconductor die each having an upper surface with a plurality of bond pads disposed thereon. The upper surface of the second semiconductor die may be substantially coextensive with the upper surface of the first semiconductor die and extend substantially along a plane. The multi-die package also includes a plurality of bonding wires each coupling one of the bond pads on the upper surface of the first semiconductor die to a corresponding one of the bond pads on the upper surface of the second semiconductor die. A bonding wire of the plurality of bonding wires has a kink disposed at a height above the plane, a first hump disposed between the first semiconductor die and the kink, and a second hump disposed between the second semiconductor die and the kink.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully