Integrated circuit package-in-package system housing a plurality of stacked and offset integrated circuits and method of manufacture therefor
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United States of America Patent
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Feb 3, 2015
Grant Date -
Jun 11, 2009
app pub date -
Dec 6, 2007
filing date -
Dec 6, 2007
priority date (Note) -
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Abstract
An integrated circuit package-in-package system is provided including mounting first integrated circuits stacked in a first offset configuration over a die-attach paddle having a first edge and a second edge, opposing the first edge; connecting the first integrated circuits and a second edge lead adjacent the second edge; mounting second integrated circuits stacked in a second offset configuration, below and to the die-attach paddle; connecting the second integrated circuits and a first edge lead adjacent to the first edge; and encapsulating the first integrated circuits, second integrated circuits, and the die-attach paddle, with the first edge lead and the second edge lead partially exposed.
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