Method for producing metal thin film
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 3, 2015
Grant Date -
Jan 5, 2012
app pub date -
Sep 15, 2011
filing date -
Jun 15, 2007
priority date (Note) -
In Force
status (Latency Note)
![]() |
A preliminary load of PAIR data current through [] has been loaded. Any more recent PAIR data will be loaded within twenty-four hours. |
PAIR data current through []
A preliminary load of cached data will be loaded soon.
Any more recent PAIR data will be loaded within twenty-four hours.
![]() |
Next PAIR Update Scheduled on [ ] |

Importance

US Family Size
|
Non-US Coverage
|
Patent Longevity
|
Forward Citations
|
Abstract
A method for producing a metal thin film on a substrate includes: a step of applying an ink to a flat blanket; a first transfer step of bringing the first blanket and a letterpress having a predetermined pattern of projections into contact by a pressure compression while the flat blanked and the letterpress being disposed opposite each other, to selectively transfer a portion of the ink on the flat blanket corresponding to the projections to the letterpress; a second transfer step of bringing the flat blanket obtained after the first transfer step and the substrate into contact by pressure compression while the flat blanket and the substrate being disposed opposite each other, to transfer the ink remaining on the flat blanket to the substrate; and a step of subjecting the substrate obtained after the second transfer step to electroless plating to deposit a metal thin film on the substrate.
First Claim
all claims..Other Claims data not available
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
SONY CORPORATION | 1-7-1 KONAN MINATO-KU TOKYO 108-0075 |
International Classification(s)

- 2011 Application Filing Year
- B41F Class
- 243 Applications Filed
- 175 Patents Issued To-Date
- 72.02 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Ishihara, Hirotsugu | Tokyo, JP | 10 | 57 |
# of filed Patents : 10 Total Citations : 57 | |||
Kamei, Takahiro | Kanagawa, JP | 45 | 491 |
# of filed Patents : 45 Total Citations : 491 | |||
Shimamura, Toshiki | Kanagawa, JP | 17 | 116 |
# of filed Patents : 17 Total Citations : 116 | |||
Tanaka, Masanobu | Kanagawa, JP | 104 | 939 |
# of filed Patents : 104 Total Citations : 939 |
Cited Art Landscape
- No Cited Art to Display

Patent Citation Ranking
- 0 Citation Count
- B41F Class
- 0 % this patent is cited more than
- 10 Age
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Aug 3, 2026 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

Legal Events
Date | Code | Event | Description |
---|---|---|---|
May 07, 2021 | MAFP | MAINTENANCE FEE PAYMENT | free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY year of fee payment: 4 |
Nov 07, 2017 | I | Issuance | |
Oct 18, 2017 | STCF | INFORMATION ON STATUS: PATENT GRANT | free format text: PATENTED CASE |
May 18, 2017 | P | Published | |
Jan 31, 2017 | F | Filing | |
Dec 03, 2009 | PD | Priority Date |

Matter Detail

Renewals Detail
