Thermosetting polymer-based composite materials
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United States of America Patent
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Jan 27, 2015
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N/A
app pub date -
Sep 30, 2009
filing date -
Jan 22, 2008
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Abstract
The present invention relates to a lead-free, non-toxic and arc resistant composite material having a thermosetting polymer, at least one heavy particulate filler, at least one light particulate filler and, optionally, at least one arc resistant filler. The composite material may be utilized in manufacturing articles used in radiation shielding and other applications where arc resistant and dielectric strength are desired.
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| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jul 27, 2026 |
