Methods for fabricating a semiconductor wafer processing device
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United States of America Patent
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Jan 27, 2015
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app pub date -
Apr 10, 2012
filing date -
Apr 10, 2012
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Abstract
A method of fabricating a semiconductor processing device includes providing a susceptor including a substantially cylindrical body portion having opposing upper and lower surfaces. The body portion has a diameter larger than a wafer diameter. The method also includes providing a set of holes circumferentially disposed at a first susceptor diameter, the set of holes being evenly spaced with respect to adjacent holes and extending through the upper and lower surfaces in an area. The first susceptor diameter is larger than the wafer diameter, and holes are omitted along the first diameter in a set of predetermined orientations.
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