Electronic component and fabrication process of this electronic component
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United States of America Patent
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Jan 20, 2015
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N/A
app pub date -
Dec 6, 2013
filing date -
Dec 7, 2012
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Abstract
An electronic component comprising a substrate extending in a plane, having electrical connections to connect the component to a circuit, and having an upper face; an electronic chip arranged on the upper face or inside the substrate and connected to the connections via the substrate, a thick insulating layer forming a package and covering the upper face or at least part of the chip, and having an outer face parallel to the plane; a cavity inside the thick layer, the cavity having a bottom parallel to the plane and a side extending from the bottom to the outer face, the cavity having heat-absorbing material inside that is different from the material forming the thick layer. The heat-absorbing material has a specific heat capacity greater than 1 kJKg−1K−1 at a 25° C. and at 100 kPa. Either a bottom or side of the cavity is covered with a interface layer.
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