Package-on-package proximity sensor module
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United States of America Patent
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Jan 20, 2015
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N/A
app pub date -
Oct 8, 2010
filing date -
Oct 8, 2010
priority date (Note) -
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Abstract
A package-on-package proximity sensor module including a infrared transmitter package and a infrared receiver package is presented. The proximity sensor module may include a fully-assembled infrared transmitter package and a fully-assembled infrared receiver package disposed on a quad flat pack no-lead (QFN) lead frame molded with an IR cut compound housing. A bottom surface of the QFN lead frame may be etched and covered with the IR cut compound to provide a locking feature between the QFN lead frame and the IR cut compound housing.
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