Micro laser assisted machining
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United States of America Patent
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Jan 13, 2015
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app pub date -
Sep 28, 2005
filing date -
Sep 28, 2005
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Abstract
A method and apparatus (1) for machining a semiconductor or ceramic workpiece (32) causes a portion of the workpiece to undergo high pressure phase transformation to form a high pressure phase transformation portion which has altered optical properties from the remainder of the workpiece. A laser is irradiated on the high pressure transformation portion to heat the high pressure transformation portion and cause it to soften and then the workpiece is plastically deformed, at smaller loads and forces, along the softened portion in order to accomplish the machining of the workpiece with a machining tool (21).
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