Family

Loading Family data...

• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD	NO 8 LI-HSIN ROAD 6 HSINCHU SCIENCE PARK HSINCHU 300

International Classification(s)

• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Chang, Hsin	Hsin-Chu, TW	12	475
Chiou, Wen-Chih	Miaoli, TW	414	9438
Jeng, Shin-Puu	Hsin-Chu, TW	851	18082
Lin, Jing-Cheng	Hsin-Chu, TW	575	17188
Tsai, Fang Wen	Hsin-Chu, TW	24	869

Cited Art Landscape

Load Citation

• No Cited Art to Display

Loading Cited Art Landscape...

Patent Citation Ranking

Forward Cite Landscape

Load Citation

• No Forward Cites to Display

Loading Forward Cite Landscape...

Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Jul 6, 2026

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
January 06, 2015	US,8928159,B2   US8928159B2	GRANTED PATENT AS SECOND PUBLICATION
March 08, 2012	US,20120056315,A1   US20120056315A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 8928159

Alignment marks in substrate having through-substrate via (TSV)

---

 

Legal Events