Binder composition for electrodes and electrode mix slurry

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United States of America Patent

PATENT NO 8927151
SERIAL NO

13514714

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Abstract

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A binder composition for electrodes with greater binding strength that does not inhibit the formation of a stable electrode interface (SEI) on the surface of an active substance is provided. The binder composition for electrodes includes at least one type of tetracarboxylic acid ester compound, at least one type of diamine compound, and an organic solvent. Furthermore, the organic solvent preferably has a boiling point that is 250° C. or less. In addition, the organic solvent preferably has a highest occupied molecular orbital (HOMO) that is −10 eV or less.

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Patent Owner(s)

Patent OwnerAddress
I S T CORPORATIONOTSU-SHI SHIGA 520-2153

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Moriuchi, Koji Otsu, JP 7 22
Takeda, Yasuaki Otsu, JP 12 92

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