Lift-off deposition system featuring a density optimized HULA substrate holder in a conical deposition chamber
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United States of America Patent
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Jan 6, 2015
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app pub date -
Apr 22, 2010
filing date -
Apr 28, 2009
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Abstract
A vapor deposition device using a lift-off process includes an evaporation source, a support frame mounted for rotation about a first axis that passes through the evaporation source, a central dome-shaped wafer holder mounted to the support frame wherein a centerpoint of the central dome-shaped wafer holder is aligned with the first axis, an orbital dome-shaped wafer holder mounted to the support frame in a position offset from the first axis and rotatable about a second axis that passes through a centerpoint of the orbital dome-shaped wafer holder and the evaporation source, and a plurality of wafer positions on the central dome-shaped wafer holder and the orbital dome-shaped wafer holder where each of the wafer positions are offset from the first axis and the second axis.
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