Bonding head with a heatable and coolable suction member
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United States of America Patent
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Jan 6, 2015
Issued Date -
N/A
app pub date -
Jan 17, 2014
filing date -
Jan 21, 2013
priority date (Note) -
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Abstract
A bonding head for mounting semiconductor chips on a substrate comprises a bonding head body and a suction member formed of a single piece. The elements necessary for heating, cooling and monitoring the temperature of the suction member are all integrated into the suction member, so that neither the heating nor the cooling elements are separated from the semiconductor chip by a surface preventing the heat transfer. The bonding head body contains only the elements necessary for supplying the suction member with electrical power and with the cooling medium.
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