High temperature and vibration protective electronic component packaging
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United States of America Patent
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Dec 30, 2014
Issued Date -
N/A
app pub date -
Mar 7, 2012
filing date -
Mar 7, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
An electronic component package for installation on a tool includes: a solid molded housing configured to hold an electronic component support structure and surround electronic components disposed on the support structure; the housing including a first portion configured to hold the support structure, and a second portion forming a cavity around the electronic components disposed on the support structure and isolating the electronic components from contact with the housing; and a viscoelastic damping layer disposed within the first portion, the viscoelastic cushion configured to damp vibrations and strain transmitted from the tool, the viscoelastic damping layer forming a constrained layer between the support structure and the first portion and configured to isolate the support structure from the housing.
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