Method for manufacturing device

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United States of America Patent

PATENT NO 8921135
SERIAL NO

14115073

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Abstract

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A method for manufacturing a device having a concavo-convex structure includes forming an organic resist film on an n-type semiconductor layer in which a fine concavo-convex structure is to be formed; forming a silicon-containing resist film on the organic resist film; patterning the silicon-containing resist film by nanoimprint; oxidizing the silicon-containing resist film with oxygen-containing plasma to form a silicon oxide film; dry-etching the organic resist film by using the silicon oxide film as an etching mask; dry-etching the n-type semiconductor layer by using the silicon oxide film and the organic resist film as an etching masks; and removing the silicon oxide film and the organic resist film.

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Patent Owner(s)

Patent OwnerAddress
TOSHIBA KIKAI KABUSHIKI KAISHACHIYODA-KU TOKYO 1000011
ULVAC INC2500 HAGISONO CHIGASAKI-SHI KANAGAWA 2538543 ?2538543
MARUBUN CORPORATION8-1 NIHONBASHI ODENMACHO CHUO-KU TOKYO 1038577 ?1038577

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kamimura, Ryuichiro Susono, JP 12 110
Kashima, Yukio Tokyo, JP 9 87
Nishihara, Hiromi Numazu, JP 8 92
Ookawa, Takafumi Numazu, JP 10 119
Osada, Yamato Susono, JP 11 86
Tashiro, Takaharu Numazu, JP 16 131

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