Method of bonding conductive material to stainless steel, and HDD magnetic head suspension

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United States of America Patent

PATENT NO 8920887
SERIAL NO

13339911

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Abstract

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A method of bonding a conductive material to stainless steel includes: a first step of applying a conductive paste to a surface of a base plate made of the stainless steel; and a second step of removing, in an area located within the surface of the base plate and covered with the conductive paste, a part of a passivation film on a surface of the stainless steel without allowing a base material of the stainless steel of the base plate to come into contact with air. The removing of the passivation film is achieved, for example, by irradiation of laser light.

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Patent Owner(s)

Patent OwnerAddress
SUNCALL CORPORATION14 UMEZU NISHIURA-CHO UKYO-KU KYOTO-SHI KYOTO 615-8555

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kashimoto, Syuuichi Kyoto, JP 1 3
Mashimo, Kenji Kyoto, JP 10 154

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