Wrapping an object with a film using a tape for cutting the film
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United States of America Patent
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Dec 30, 2014
Issued Date -
N/A
app pub date -
Oct 15, 2013
filing date -
Oct 18, 2012
priority date (Note) -
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Abstract
A pressure sensitive adhesive film attached to a surface is cut by pulling a filament from an adhesive tape applied on to the surface through that part of the film over the tape so as to cut the film and to form a cut edge of the film. The filament is a polyester multi-fiber filament of the order of 16 tex which provides a strength to break of the order of 2 pounds force and an extension of the order of 15% under a load of 1.0 pounds force. The tape comprises a polyethylene substrate of 0.125 inch in width. The filament is extendible so that, when the tape is stretched the filament stretches with the tape and does not pull out or separate. The filament can be broken by hand and has an ability to bend to a radius of curvature of less than 0.5 inches without any stiffness in the filament.
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