Adjustable thermal forming die assembly
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United States of America Patent
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Dec 30, 2014
Issued Date -
N/A
app pub date -
May 12, 2011
filing date -
May 12, 2011
priority date (Note) -
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Abstract
An adjustable thermal die assembly is provided. The thermal die assembly includes a thermal forming die and at least one insert. The thermal forming die has at least one die cavity of a select shape. The die further has at least one opening to the at least one die cavity. The at least one insert has at least one internal passage that is conformed to have a shape of the at least one opening to the at least one die cavity of the die. Moreover, the at least one insert is configured and arranged to be selectively coupled to the die with the at least one internal passage of the at least one insert aligning with the at least one opening of the at least one die cavity to selectively increase a depth of a forming cavity of the thermal forming assembly.
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