Etch-back type semiconductor package, substrate and manufacturing method thereof
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United States of America Patent
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Dec 23, 2014
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app pub date -
Apr 28, 2011
filing date -
Apr 28, 2010
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Abstract
A semiconductor package, a substrate and a manufacturing method thereof are provided. The substrate comprises a conductive carrier, a first metal layer and a second metal layer. The first metal layer is formed on the conductive carrier and comprises an lead pad having an upper surface. The second metal layer is formed on the first metal layer and comprises a bond pad. The bond pad overlaps and is in contact with the upper surface of the first metal layer. The upper surface of the lead pad is partially exposed. A part of the bond pad overhang outward from the edge of the lead pad.
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