LED heat dissipation structure
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United States of America Patent
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Dec 23, 2014
Issued Date -
N/A
app pub date -
Apr 2, 2013
filing date -
Apr 2, 2013
priority date (Note) -
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Abstract
An LED heat dissipation structure including: a heat sink, with a lug axially extended from an end of the heat sink, a hollow portion disposed inside the heat sink and axially extended to the lug, and a plurality of fins integrally extended from a peripheral side of the heat sink; and a support base, having an axial through hole sheathed on the lug of the heat sink, and an end of the support base abutting the support surface of the heat sink. A semiconductor light emitting module is tightly coupled onto a distal surface at an end of the lug for conducting generated heat to the heat sink, and a mirror mount is pressed against the semiconductor light emitting module and coupled to the support base.
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